PCB Manufacturing Capabilities for High-Tech Applications
April 2, 2025
Since 1997, KINGBROTHER has specialized in high-speed PCB layout design and manufacturing, serving over 18,000 customers worldwide and helping them bring products from prototype to market quickly. With five design centers and four manufacturing bases, we provide comprehensive capabilities for high-end, complex products.
Our product type covers high-speed multi-layer boards, metal-based boards, thick copper boards, and rigid-flex boards, all without minimum order quantity requirements. They are widely applied to communication, automotive, industrial control, AI, and medical equipment. We have become a major supplier for leading global enterprises, with whom we have established long-term and stable cooperative relationships.
| PCB Capability — Kingbrother | ||||
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| Item | Technical Capabilities | |||
| Prototype | Volume | |||
| Product Type | Embedded Resistor & Capacitor Embedded Magnetic Core Embedded Component Embedded Copper Block Embedded Sub-board 77G Radar Products Self-clinching Nut High resistance carbon oil Substrate-Like PCB IC-Substrate |
Single / Double Sided Multi-layer HDI High-frequency Cavity Rigid-flex Heavy Copper Hybrid High-Frequency Mechanical Buried & Blind Via Metal Base Metal Core High-speed Backplane High-speed Optical Module 5G Antenna |
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| Material | Halogen Free/ Lead Free | SHENGYI: S1000H（has UL & CUL）、S1000-2M（has UL & CUL）、S1150G、S1170G； Wazam H150、H1170;（both has UL & CUL） ITEQ IT158、IT180A (has UL & CUL）；TU752、TU865 |
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| High-speed Material | SHENGYI S6N、S7439； Panasonic M6；TU872-SLK、TU883、TU933+、TU943N； ITEQ IT-170GT | |||
| High-frequency Material | Rogers RO4003, RO4350B（has UL） ； Taconic TLY-5 、 TLX-8 、 TSM-DS3 ； Panasonic R5575 ； SHENGYI SG220/255/300 ； WazamFSD220/255/300/615T/1020T | |||
| Flex Section Material | Panasonic RF-775 ； ThinFlex W 、 High-speed Flex Board (LK series) ； Dupont AG Flex Board | |||
| Others | BT Material High Thermal Conductivity Material Copper Base Aluminum Base Rigid PI (VT901), Buried Capacitor Material, Buried Resistor Copper Foil, Magnetic Core Material, High Resistance Carbon ink. |
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| Signal Transfer Rate | Max: 112Gbps | Max: 25Gbps | ||
| Layers | FR4 | 68,30 | ||
| Rigid-Flex | Total/Flexible:32/24,Total/Flexible:20/12 | |||
| Hybrid High-Frequency | 28,20 | |||
| Pure PTFE | 24,16 | |||
| HDI | 48/5+N+5, 28/4+N+4 | |||
| Substrate | 10,6 | |||
| Size | Rigid Board | Max:550mm*900mm, Max:550mm*620mm | ||
| Double-sidedFlexible Board | Max:2000*200mm, Max:1250*200mm | |||
| Max Final Board Thickness | 12mm, 6.5mm | |||
| Via Diameter | Mechanical Hole | Min:0.10mm, Min:0.15mm | ||
| Laser Hole | Min:0.10mm, Min:0.10mm | |||
| Half Hole | Min:0.30mm, Min:0.40mm | |||
| Via to Via Clearance | Same Nets | Min:0.13mm, Min:0.2mm | ||
| Different Nets | Min:0.25mm, Min:0.30mm | |||
| Via to inner layer copper/track | ≤10L | Min:0.125mm, Min:0.15mm | ||
| > 10L | Min:0.15mm, Min:0.18mm | |||
| Aspect Ratio | 20:1, 16 ： 1 | |||
| Solder Bridge | Green | Min:3.0 mil, Min:4.0 mil | ||
| Other Colors | Min:4.5 mil, Min:5.0 mil | |||
| Resin Filling Via Diameter | 0.08-0.8 mm, 0.1-0.6 mm | |||
| Impedance Tolerance | ±5%, ±10% | |||
| Gold Thickness | ENIG | MAX ： 5-8u”, MAX ： 3-8u” | ||
| Soft Ni/Au Plating | MAX ： 80-120u”, MAX ： 1-3u” | |||
| Hard Ni/Au Plating | MAX ： 80 u”, MAX ： 30 u” | |||
| Surface Finish | HASL-LF; OSP; Immersion Ag; Immersion Tin; ENIG; ENEPIG; Plating Gold | |||
| Special Capabilities | Thick Copper with Blind Buried Via Metal Core Rigid-flex Embedded Copper Block Hybrid High-frequency Gold Finger Back Drilling Deep Slot Milling Hole on Pad Half Hole |
Countersink Hole Sidestep Slot Via Overlapping Via Peelable Mask Laser Cutting Resin Filling Mixed Surface Treatment Buried Components Buried Sub-board Self-clinching Nut Welding Metal Board |
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