We offer a full range of electronic assembly services, including SMT, THT,Hybrid technology assemblyAutomated assembly line.

Substrate materials affect PCB performance through their electrical properties, including dielectric constant and loss, which influence signal integrity. Thermal conductivity is key for heat management, and mechanical strength impacts durability. The right choice ensures optimal PCB operation.

Designing HDI PCBs presents challenges due to the fine features and high layer counts. These include managing high-density routing, ensuring signal integrity with controlled impedance, and addressing thermal management issues. Additionally, HDI PCBs often require specialized materials and processes, such as laser drilling for microvias and sequential lamination for complex stackups. Design for manufacturability (DFM) […]

Designing HDI PCBs presents challenges due to their excellent characteristics and high layer counts. These include managing high-density routing, ensuring signal integrity by controlling impedance, and addressing thermal management issues. Additionally, HDI PCBs often require specialized materials and processes, such as laser drilling for microvias and sequential lamination for complex stacking. Ensuring good electrical connection […]

The flexibility of rigid-flex PCBs requires careful design, especially in bending areas where components such as pads and vias should be minimized. The thickness of the flexible substrate and copper cladding should be as thin as possible to enhance durability. Designers must also consider appropriate bending radii and material selection to ensure the reliability and […]