Substrate model: TU872SLK
Layers/board thickness: 10L/2.0mm
Line width/space: 0.11/0.10mm
Minimum hole diameter: 0.25mm
Surface finish: Gold Plating
Features: High-speed substrate, high-precision impedance control
Application fields: Medical controller board
Features: Metal base and ceramic materials, featuring thermal conductivity exceeding 30W/mk.
Application fields: Power
Material: RO4350B+TU872SLK
Layer Count: 18L
Board Thickness: 2.5mm (Gold Finger 1.6mm)
Minimum line width/space: 4.0mil/4.0mil
Partial gold plating thickness: 30 micro-inches
Application fields: Communication
Materials: High-speed halogen-free materials
Structure: HDI PCB with staggered vias
Layer: ≥10 step
Trace width & space:0.075 /0.075mm
Coil resistance: ±5%
Surface finish: Immersion gold
Application fields: Artificial intelligence