Features: Precise control of heaters and cooling systems
Assembly process: Single-sided SMT combined with single-sided THT mixed mounting
Main chip: STM32F103ZET6
Application fields: Medical
Features: Coordinates the sending and receiving of data, commands, or information between the host and the network
Assembly process: Double-sided SMT combined with single-sided THT mixed mounting
Main chip: ZYNQ7020, Xilinx
Application fields: Data Transmission
Machine model: XC3S1200E-5FTG256C, Xilinx
Circuit modules: Core processor module, DRAM storage module, PMIC power supply module, digital signal processor (DSP) module, network port module
Assembly process: Double-sided SMT combined with single-sided THT mixed mounting
Function Implemented: Device core processor
Features: Three-axis acceleration board, data acquisition board, baseboard, and core board, with remote monitoring capabilities
Assembly Process: Double-sided SMT combined with single-sided THT mixed mounting
Main chip: RK3288
Application fields: Artificial intelligence