Features: Coordinates the sending and receiving of data, commands, or information between the host and the network
Assembly process: Double-sided SMT combined with single-sided THT mixed mounting
Main chip: ZYNQ7020, Xilinx
Application fields: Data Transmission
Material: RO4350B+TU872SLK
Layer Count: 18L
Board Thickness: 2.5mm (Gold Finger 1.6mm)
Minimum line width/space: 4.0mil/4.0mil
Partial gold plating thickness: 30 micro-inches
Application fields: Communication
KINGBROTHER is committed to providing high-performance, reliable electronic manufacturing solutions, and PCB design services that enable communication equipment manufacturers to stay ahead of the curve and deliver cutting-edge technologies to the world.
KINGBROTHER has designed it to provide robust network support for modern mobile offices, outdoor adventures, and emergency responses, with their exceptional wireless connectivity, rock-solid security, and reliable operation in challenging environments.
