KINGBROTHER is dedicated to partnering with medical device manufacturers to bring innovative and life-saving PCB design products to market quickly and efficiently, while adhering to the strictest regulatory standards.
KINGBROTHER is committed to providing power companies with high-quality, high-technology electronic manufacturing solutions and a reliable PCB assembly manufacturer to build a sustainable and connected energy future.
KINGBROTHER is committed to get the flexibility and expertise you need to meet the variable manufacturing needs for your complex industrial products.
KINGBROTHER specializes in AI hardware, offering adaptable and expert solutions for complex industrial product manufacturing, driving innovation in the AI industry.
Features: Precise control of heaters and cooling systems
Assembly process: Single-sided SMT combined with single-sided THT mixed mounting
Main chip: STM32F103ZET6
Application fields: Medical
Features: Coordinates the sending and receiving of data, commands, or information between the host and the network
Assembly process: Double-sided SMT combined with single-sided THT mixed mounting
Main chip: ZYNQ7020, Xilinx
Application fields: Data Transmission
Machine model: XC3S1200E-5FTG256C, Xilinx
Circuit modules: Core processor module, DRAM storage module, PMIC power supply module, digital signal processor (DSP) module, network port module
Assembly process: Double-sided SMT combined with single-sided THT mixed mounting
Function Implemented: Device core processor
Features: Three-axis acceleration board, data acquisition board, baseboard, and core board, with remote monitoring capabilities
Assembly Process: Double-sided SMT combined with single-sided THT mixed mounting
Main chip: RK3288
Application fields: Artificial intelligence
Substrate model: TU872SLK
Layers/board thickness: 10L/2.0mm
Line width/space: 0.11/0.10mm
Minimum hole diameter: 0.25mm
Surface finish: Gold Plating
Features: High-speed substrate, high-precision impedance control
Application fields: Medical controller board
Features: Metal base and ceramic materials, featuring thermal conductivity exceeding 30W/mk.
Application fields: Power
Material: RO4350B+TU872SLK
Layer Count: 18L
Board Thickness: 2.5mm (Gold Finger 1.6mm)
Minimum line width/space: 4.0mil/4.0mil
Partial gold plating thickness: 30 micro-inches
Application fields: Communication
Materials: High-speed halogen-free materials
Structure: HDI PCB with staggered vias
Layer: ≥10 step
Trace width & space:0.075 /0.075mm
Coil resistance: ±5%
Surface finish: Immersion gold
Application fields: Artificial intelligence