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1、hundreds of more than 10 years PCB experience in the professional and technical team, for you to create high stability of the products and services.

2、35 (8 authorized) national invention patents, 141 (132 authorized) utility model patents, 53 software copyright and other technical achievements have been transformed into productive forces, effectively optimize the production quality and efficiency.

3、to the provincial technical center and the provincial engineering center as a technology development and technical services platform, won the high-tech enterprises that have a number of high-tech products that the Science and Technology Award, 20 years focused on PCB R & D and manufacturing.









1、high-precision step board processing technology.

2、A variety of types of rigid and flexible combination of process structure to meet the needs of different communication products, three-dimensional assembly.

3、half hole and board side of the package metal technology, to meet the special needs of customers.






Automatic drilling equipment, LDI laser direct imaging equipment, hot melt machine, BURKEL vacuum press, X-RAY drilling machine, AOI, high precision control deep drilling rig, laser drilling machine, plasma separator, automatic plating line, Automatic V-CUT machine, automatic beveling machine, flying probe testing machine, ion pollution tester, ROHS tester, Tektronix impedance tester, high-precision control of the external equipment, automatic V-CUT machine, automatic beveling machine, X-RAY gold and nickel thickness of the detection equipment.






1、Jin Baize was Guangdong Province, cleaner production certification enterprises, cleaning production enterprises in Shenzhen City, Pengcheng waste reduction advanced enterprises, circuit board industry, the title of advanced environmental protection enterprises.

2、Kim Pui as green as their responsibility, with you care about your living environment, and jointly create a green home.






Type: Rigid and flexible combination

Number of layers / thickness: 8L / 0.9mm

Line width / line distance: 5.0 / 4.5mil

Technical features: 2L soft board + 6L hard board rigid-flex joint plate, soft plate area with pads


Name: 2G module

Type: High density board

Number of layers / thickness: 4L / 1.0mm

Line width / line distance: 6.2 / 4.5mil

Technical characteristics: impedance, figure gold, the length of gold finger



Name: Development board

Type: double panel

Number of layers / thickness: 6L / 1.0mm

Line width / line distance: 3.0 / 3.5mil

Technical features: HDI blind hole filling, impedance, buried hole resin plug hole


Name: 4G module

Type: HDI board

Number of layers / thickness: 4L / 1.0mm

Line width / line distance: 4 / 4mil

Technical features: impedance, half hole




Name: Module adapter board

Type: High density board

Number of layers / thickness: 4L / 1.0mm

Line width / line distance: 3 / 4mil

Technical features: impedance, fine lines