Our expertise ensures that your designs move swiftly from concept to reality, allowing you to stay ahead in the competitive market.

Multilayer Board
Multilayer Board

Substrate model: TU872SLK
Layers/board thickness: 10L/2.0mm
Line width/space: 0.11/0.10mm
Minimum hole diameter: 0.25mm
Surface finish: Gold Plating
Features: High-speed substrate, high-precision impedance control
Application fields: Medical controller board

High Thermal Conductivity and High Heat Dissipation PCB
High Thermal Conductivity and High Heat Dissipation PCB

Features: Metal base and ceramic materials, featuring thermal conductivity exceeding 30W/mk.
Application fields: Power

Step Gold Finger PCB
Step Gold Finger PCB

Material: RO4350B+TU872SLK
Layer Count: 18L
Board Thickness: 2.5mm (Gold Finger 1.6mm)
Minimum line width/space: 4.0mil/4.0mil
Partial gold plating thickness: 30 micro-inches
Application fields: Communication

Fine-Pitch (2mm) Rigid- Flex Board
Fine-Pitch (2mm) Rigid- Flex Board

Layers: 6L
Board Thickness: 1.0mm
Minimum line width/space: 5mil/4mil
Application fields: Industrial control

High Step HDI PCB with Staggered Vias
High Step HDI PCB with Staggered Vias

Materials: High-speed halogen-free materials
Structure: HDI PCB with staggered vias
Layer: ≥10 step
Trace width & space:0.075 /0.075mm
Coil resistance: ±5%
Surface finish: Immersion gold
Application fields: Artificial intelligence

CONTACT US
Connect With Our Expert Now
Get in Touch