KINGBROTHER’s agile manufacturing for high-mix, low-volume orders, accelerating your R&D process.
Application fields: Power transformer
Layer/ thickness: 4L/2.4mm
Surface finish:immersion gold
Line width/space: 12.2/4.2mil
Minimum aperture: 0.5mm
Technical features: Blind hole, magnetic core embedded structure
Application fields: Communication
Layer/ thickness: 5L/1.9mm
Surface finish: Immersion gold
Line width/space: 9.0/9.2mil
Minimum aperture: 0.3mm
Technical features: Three-step groove structure
Application fields: Power amplifier equipment,high power module,LED
Layer/ thickness: 4L/3.0mm
Surface finish: Immersion gold
Line width/space: 9.8/7.7mil
Minimum aperture: 0.25mm
Technical features: High heat dissipation, embedded metal base
Application fields: Heavy copper Rigid-flex/power module
Layer:18L (flex 14 layers)
Copper thickness of flex board: 20Z
Minimum line width/space: 4.5mil/4.5mil
Application fields: Communication
Layer/ thickness: 12L/2.1mm
Surface finish: Immersion gold
Line width/space: 5.0/5.0mil
Minimum aperture: 0.5mm
Technical features: Four-time high-precision controlled-depth back drilling
Application fields: Heavy copper HDl board/power module
Material: S1000-2
Layer: 12L
Copper thickness: 30Z (inner and outer layers)
Minimum line width/space: 4.5mil/4.5mi
Application fields: High-power power module, high-current industrial control equipment
Layer/ thickness: 4L/3.0mm
Surface finish: Immersion gold
Line width/space: 20/20mi
Minimum aperture: 0.8mm
Technical features: Copper thickness 18 OZ
Application fields: Communication
Layer/ thickness: 8L/1.6mm
Surface finish: Immersion gold+electric gold finger
Line width/space: 4/4mil
Minimum aperture: 0.2mm
Technical features: Long gold finger structure, high shape accuracy
At KINGBROTHER, we serve diverse industries with ISO9001/ISO14001-certified quality systems. Our advanced quality assurance, including SPC, MSA, FMEA, APQP, and PPAP, ensures we meet the strict standards of over 15,000 R&D customers. Every PCB undergoes 100% E-testing and AQ checks, with reliability tests for high voltage, thermal cycling, impedance control, solderability, and more.
PCBs play a critical role across various industries. In artificial intelligence, they support advanced computing and data processing in AI systems. In the medical field, PCBs are vital for precision devices like diagnostic tools and wearables, adhering to strict safety standards. For the Power sector, they handle high currents and voltages in systems like power supplies and renewable energy. In communication, PCBs enable high-speed data transfer and reliable communication in networks and devices. Lastly, in industrial control, they provide precise control in automation systems and robotics, ensuring efficiency and durability in harsh environments.
Total layer/flex layer for prototype: 28/16
Total layer/flex layer for volume: 20/12
Minimum line width/space for prototype: 30/30 um
Minimum line width/space for volume: 40/40 um
Mitsubishi laser drilling, boker pressing machine, ORC LDI, orbotech inkjet printer, orbotech inkjet printer, auto plating.
3D solder paste, online AOI inspection, X-RAY, energy dispersive X thickness gauge, fluorescence.
We have advanced PCB manufacturing technology and equipment to produce various types of circuit boards, including Multilayer PCB(up to 68 layers), HDI PCB, Rigid-Flex PCB and High frequency PCB.
Our design services follow DFM guidelines, conduct a Design Rule Check (DRC), and provide clear Gerber files to the manufacturer. Consider trace widths, layer stack-up, and avoid difficult-to-produce features.
Common surface finishes include HASL, immersion tin, immersion silver, ENIG, OSP, and lead-free HASL. Each finish has specific properties and is chosen based on application requirements, cost, and environmental considerations.
Our testing services include a variety of testing methods to ensure that products are fully verified before they leave the factory, including FCT, ICT,AOI and environmental testing.
We can produce not only conventional FR-4 high-layer count boards but also have capabilities in manufacturing uneven thickness rigid-flex combinations, high-speed high-layer count, high-density HDI, substrates, semi-substrates, thermoelectric separation copper base boards, high-frequency laminated, high-frequency high-thermal conductivity, and embedded types (embedded resistors, embedded capacitors, embedded diodes, embedded copper, embedded magnets, etc.) product processing technologies.
1.Lead-free/Halogen-free: S1000H, S1000-2, S1150G, S1170G from Shengyi; IT158, IT180A from Lianmiao; Huazheng substrates
2.High-speed materials: TU872-SLK, TU883, TU933+ from Taiyao; M4, M6 from Panasonic; S6N from Shengyi
3.High-frequency materials: RO3003, RO4000 series; TLY-5, TLX-8, TSM-DS3; F4BM-2 series from Wangling; SG220/255/300 from Shengyi; FSD220/255/300
4.Flexible substrate materials: RF-775 series from Panasonic; W series from Xinyang; AG flexible substrate from DuPont; high-speed flexible substrate (LK series)
5.Others: BT materials, high thermal conductivity materials, copper-based, aluminum-based, rigid PI (VT901), pure ceramic substrates, embedded capacitance materials, core materials.
