Case Center
Medical industry
Printed Circuit Board
As a leading PCB prototype expert, we are committed to delivering rapid prototyping and quick-turn services that fuel innovation and accelerate your product development.
As a leading PCB prototype expert, we are committed to delivering rapid prototyping and quick-turn services that fuel innovation and accelerate your product development.
KINGBROTHER is committed to get the flexibility and expertise you need to meet the variable manufacturing needs for your complex industrial products.
KINGBROTHER specializes in AI hardware, offering adaptable and expert solutions for complex industrial product manufacturing, driving innovation in the AI industry.
Substrate model: TU872SLK
Layers/board thickness: 10L/2.0mm
Line width/space: 0.11/0.10mm
Minimum hole diameter: 0.25mm
Surface finish: Gold Plating
Features: High-speed substrate, high-precision impedance control
Application fields: Medical controller board
Features: Metal base and ceramic materials, featuring thermal conductivity exceeding 30W/mk.
Application fields: Power
Material: RO4350B+TU872SLK
Layer Count: 18L
Board Thickness: 2.5mm (Gold Finger 1.6mm)
Minimum line width/space: 4.0mil/4.0mil
Partial gold plating thickness: 30 micro-inches
Application fields: Communication
Layers: 6L
Board Thickness: 1.0mm
Minimum line width/space: 5mil/4mil
Application fields: Industrial control
Materials: High-speed halogen-free materials
Structure: HDI PCB with staggered vias
Layer: ≥10 step
Trace width & space：0.075 /0.075mm
Coil resistance: ±5%
Surface finish: Immersion gold
Application fields: Artificial intelligence
Features: Precise control of heaters and cooling systems
Assembly process: Single-sided SMT combined with single-sided THT mixed mounting
Main chip: STM32F103ZET6
Application fields: Medical
Operating voltage: 24VDC
Rated current: 1A
Standby current: 200mA
Dimensions: 233×162mm
Production process: Hybrid red glue and solder paste process
Substrate: High tg FR-4
Component grade: Industrial or Automotive-grade
Machine model: XC3S1200E-5FTG256C, Xilinx
Circuit modules: Core processor module, DRAM storage module, PMIC power supply module, digital signal processor (DSP) module, network port module
Assembly process: Double-sided SMT combined with single-sided THT mixed mounting
Function Implemented: Device core processor
Features: Three-axis acceleration board, data acquisition board, baseboard, and core board, with remote monitoring capabilities
Assembly Process: Double-sided SMT combined with single-sided THT mixed mounting
Main chip: RK3288
Application fields: Artificial intelligence
KINGBROTHER is committed to providing high-performance, reliable electronic manufacturing solutions that enable communication equipment manufacturers to stay ahead of the curve and deliver cutting-edge technologies to the world.