The integrity and low loss of signals

5G networks must function within complex electromagnetic environments, which include potential interference from other wireless signals. Calibration boards assist in mitigating such inferences, ensuring the clarity of the signal.

In order to achieve high-density wiring to adapt to compact device sizes, materials must achieve high electrical performance and thermal management:
1.Using materials with low dielectric constants(like RO4730G3 antenna grade material) and low loss to reduce signal attenuation.
2.Employing high-density interconnect (HDI) technology and fine wiring to achieve compact layouts.
3.Using high thermal conductivity and high heat dissipation materials such as metal bases and ceramics, with a local thermal conductivity of over 30W/mk, ensures high thermal performance.

Cost-effectiveness and manufacturability

Reducing production costs to the greatest extent possible while ensuring the quality of the product. This contributes to increasing the product's market competitiveness and appealing to consumers.

1.Utilizing advanced simulation and modeling tools for design optimization.
2.Controlling costs through scaled production and lean manufacturing processes ensures that 5G antenna boards meet high-performance and high-reliability standards while also achieving economic benefits and market competitiveness.